
NXP Semiconductors
PCA9922
8-channel constant current LED driver with output error detection
17.4 Package related soldering information
Table 13.
Package
Suitability of through-hole mount IC packages for dipping and wave soldering
Soldering method
Dipping
Wave
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP [2]
-
suitable
-
suitable
suitable [1]
not suitable
[1]
[2]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
18. Abbreviations
Table 14.
Acronym
CDM
EMI
ESD
HBM
LED
MM
MSB
PCB
PWM
19. Revision history
Abbreviations
Description
Charged-Device Model
ElectroMagnetic Interference
ElectroStatic Discharge
Human Body Model
Light Emitting Diode
Machine Model
Most Significant Bit
Printed-Circuit Board
Pulse Width Modulator
Table 15.
Revision history
Document ID
PCA9922 v.2
Release date
20110406
Data sheet status
Product data sheet
Change notice
-
Supersedes
PCA9922 v.1
Modifications:
?
Figure 1 “ Block diagram of PCA9922 ” : removed block “auto shutdown and auto power-up”
PCA9922 v.1
20090115
Product data sheet
-
-
PCA9922
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 6 April 2011
? NXP B.V. 2011. All rights reserved.
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